铟镓合金

Step soldering involving temperature sensitive components, Soldering to molded interconnect device (MID) plastics, Fusible alloys/fuse applications, Mercury replacement, Thermal and electrical conductivity.

Keep container tightly sealed. Store in cool, dry conditions in well sealed containers.

MFCD00144387

231-163-8

Ga:In; 40:60 wt%

Ambient temperatures.

Solid

Insoluble in water.

是